• for absorbent and non-absorbent substrates
• solvent-free, very low emissions
• drying very quickly
• excellent adhesion to the substrate
Features and use:
Solvent-free penetration, for the preparation of absorbent and non-absorbent substrates, also on old, solid, insoluble residues of old adhesives.
Not suitable for water-soluble adhesives based on sulfur lyes and bituminous adhesives.